As a engineer, Siegfried Pahlke worked for almost two decades with neutron activation analysis. Afterwards, he was for two decades with Wacker Siltronic AG and implemented TXRF as a standard method for wafer analysis. He developed the wafer surface preparation system method (WSPS) in cooperation with Gemetec in Munich. During the last ten years he was working with Ketek on detectors. Now he ist still involved as a consultant at Ketek.